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Xiaomi Teases the Release of Its New Redmi Smartphone with ‘Super Performance’

Xiaomi Teases the Release of Its New Redmi Smartphone with ‘Super Performance’

Posted on May 17, 2020May 17, 2020 by Rishabh

Xiaomi is wanting to launch another Redmi gadget in China and it might be one of the first to highlight MediaTek’s new Dimensity 820 chipset. The Chinese organization’s Vice President and Redmi General Manager Lu Weibing prodded the launch of another Redmi cell phone which will convey ‘super execution’. The launch is said to happen this month. Alongside the new elite cell phone, Xiaomi is additionally expected to launch a moderate Redmi gadget which could be the Redmi 9.

One of the greatest uncovers by the organization’s head, Weibing came as another internet based life post on Weibo where he shared MediaTek’s post on their new Dimensity SoC which will likewise bolster 5G.

MediaTek will lead a launch event on 18 May and is relied upon to uncover more insights concerning the up and coming chipset which the talk factory is calling Dimensity 820.

As of late, two Xiaomi gadgets were spotted with an unidentified MediaTek chipset on Chinese administrative site, TENNAA. One of these two gadgets could be what Weibing was discussing.

As indicated by the TENNAA posting, the chipset on the new gadget accompanies eight centers and the single center score is over 600 for the M2004J7AC model while the multi-center score was recorded more than 2000.

Passing by the leaks and the launch of the new chipset on Monday, Xiaomi may uncover the new Redmi gadget before the end of this current month. The organization as of late propelled the Redmi Note 9 which is fueled by MediaTek’s Helio G85. The gadget gets a 6.5-inch IPS LCD board with Gorilla Glass 5 protection. Redmi Note 9 likewise gets a quad-camera arrangement on the backboard.

Rishabh

He is an IT engineer and a tech geek having 13+ years of writing experience in the technology field. He is passionate about upcoming technology and loves to write on the technology niche.

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